F88126015: 1st Payment of Bond Interest (from 07/5/2026 inclusive to 07/8/2026 exclusive)
Viet Nam Securities Depository and Clearing Corporation (VSDC) would like to announce the record date of corporate action processing for the Securities registering institution as follows:
- Payment rate: 2.521 VND per bond
+ Bond interest payments are calculated using the formula: 100,000 VND x 10% x 92 days/365 days
+ The actual number of days in the interest calculation period is calculated from 07/5/2026 inclusive to 07/8/2026 exclusive
+ The actual bond interest received by bondholders will be rounded to the whole number according to the following principle: (i) if the decimal digit is greater than or equal to 5, it will be rounded up to 1VND, and (ii) if the decimal digit is less than 5, it will be rounded down to 0 VND.
- Payment date: 07/8/2026
- Payment place:
+ The holders whose shares have been deposited will receive bond interest and principal at the depository member where they opened depository account.
+ The holders whose shares have not been deposited will receive bond interest at 8th Floor, G-Group Tower, 5 Nguyen Thi Due Street, Yen Hoa Ward, Hanoi City, Vietnam via bank account of bondholders from 07/8/2026. ID cards have to be presented.
Coordination details and procedures for corporate action processing for holders of the above securities between VSDC, the Securities registering institution and depository members are specified in the Guideline on corporate action processing for securities holders at VSDC.
F88 Business Joint Stock Company and the parties involved in the process of preparing the dossier, documents of corporate action processing are fully responsible before the law for the legality, accuracy, truthfulness and completeness of the dossier; Institutions and individuals participating in the confirmation of records and documents shall be legally responsible within the scope related to such records and documents as prescribed in Clause 1, Article 11a of the Securities Law No. 54/2019/QH14 dated 26/11/2019, supplemented by Clause 4, Article 1 of Law No. 56/2024/QH15 dated 29/11/2024.
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F88126015: Bond Registration
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